Device and method for repairing a semiconductor memory

ABSTRACT

A block repair device is used in a Dynamic Random Access Memory (DRAM) having a primary array with a defective cell and a redundant array with a redundant row. The block repair device includes a set of fuses, anti-fuses, or flash EEPROM cells that store a block repair configuration that determines the dimensions (e. g., the number of rows and columns spanned) of a repair block used to repair the defective cell. Routing circuitry, such as mux circuitry, in the block repair device is configured by the stored block repair configuration to output some row and column address bits from received row and column addresses in a selected ratio. Comparison circuitry in the block repair device then compares the row and column address bits output by the routing circuitry with a stored portion of the address of the defective cell that defines the repair block. When a match occurs, the comparison circuitry implements a block repair by activating the redundant row and by causing data to be written to or read from the activated redundant row instead of the primary array.

BACKGROUND OF THE INVENTION

1. Technical Field

This invention relates in general to memory cell redundancy insemiconductor memories and, more particularly, to devices and methodsfor repairing semiconductor memories by replacing memory blocks thatcontain failing memory cells with redundant rows or columns of cells.

2. State of the Art

Semiconductor memories generally include a multitude of memory cellsarranged in rows and columns. Each memory cell is capable of storingdigital information in the form of a “1” or a “0” bit. To write (i.e.,store) a bit into a memory cell, a binary memory address having portionsidentifying the cell's row (the “row address”) and column (the “columnaddress”) is provided to addressing circuitry in the semiconductormemory to activate the cell, and the bit is then supplied to the cell.Similarly, to read (i.e., retrieve) a bit from a memory cell, the cellis again activated using the cell's memory address, and the bit is thenoutput from the cell.

Semiconductor memories are typically tested after they are fabricated todetermine if they contain any failing memory cells (i.e., cells to whichbits cannot be dependably written or from which bits cannot bedependably read). Generally, when a semiconductor memory is found tocontain failing memory cells, an attempt is made to repair the memory byreplacing the failing memory cells with redundant memory cells providedin redundant rows or columns in the memory.

Conventionally, when a redundant row is used to repair a semiconductormemory containing a failing memory cell, the failing cell's row addressis permanently stored (typically in pre-decoded form) on a chip on whichthe semiconductor memory is fabricated by programming a non-volatileelement (e.g., a group of fuses, anti-fuses, or FLASH memory cells) onthe chip. Then, during normal operation of the semiconductor memory, ifthe memory's addressing circuitry receives a memory address including arow address that corresponds to the row address stored on the chip,redundant circuitry in the memory causes a redundant memory cell in theredundant row to be accessed instead of the memory cell identified bythe received memory address. Since every memory cell in the failingcell's row has the same row address, every cell in the failing cell'srow, both operative and failing, is replaced by a redundant memory cellin the redundant row.

Similarly, when a redundant column is used to repair the semiconductormemory, the failing cell's column address is permanently stored(typically in pre-decoded form) on the chip by programming anon-volatile element on the chip. Then, during normal operation of thesemiconductor memory, if the memory's addressing circuitry receives amemory address including a column address that corresponds to the columnaddress stored on the chip, redundant circuitry in the memory causes aredundant memory cell in the redundant column to be accessed instead ofthe memory cell identified by the received memory address. Since everymemory cell in the failing cell's column has the same column address,every cell in the failing cell's column, both operative and failing, isreplaced by a redundant memory cell in the redundant column.

Thus, for example, as shown in FIG. 1, a semiconductor memory 20 havingfailing memory cells 22, 24, 26, 28, 30, 32, 34, and 36 is repaired inthe conventional manner described above using redundant rows 38, 40, and42 and redundant columns 44, 46, and 48. As described above, the memory20 is repaired by replacing all memory cells in columns 50, 52, and 54,including failing memory cells 22, 24, 26, and 28, with redundant memorycells in redundant columns 44, 46, and 48. Further repairs to the memory20 are accomplished by replacing all memory cells in rows 56, 58, and60, including failing memory cells 30, 32, 34, and 36, with redundantmemory cells in redundant rows 38, 40, and 42.

The process described above for repairing a semiconductor memory usingredundant rows and columns is well known in the art, and is described invarious forms in U.S. Pat. Nos. 4,459,685, 4,601,019, 5,422,850, and5,528,539.

Unfortunately, it is difficult to provide enough redundant rows orcolumns in a semiconductor memory to repair all failing memory cellstherein using the conventional repair process described above withoutusing an excessive amount of space (commonly known as “real estate”) inthe memory for the redundant rows or columns. With the increasing sizeof semiconductor memories continuously increasing the need forredundancy, memory designers find themselves caught between providingsufficient redundancy to successfully repair most memories and, as aresult, using excessive space in the memories, or providing insufficientredundancy to save space in the memories and, as a result, having todiscard memories that are un-repairable. Obviously, neither alternativeis desirable.

U.S. Pat. No. 5,548,225 to Rountree et al. discloses a repair systemthat, in contrast to the conventional repair system described above,does not use an entire redundant row or column to repair each defectivememory cell in a semiconductor memory. In the Rountree repair system,the column address of a defective memory cell is stored using fuses inthe same manner as described above. In addition, though, a partial rowaddress common to a group of cells in the defective cell's column thatincludes the defective cell itself is also stored using fuses. When amemory address is received having column and row addresses that matchthe stored column address and stored partial row address, a redundantmemory cell in a spare column is accessed. As a result, all of the cellsin the group identified by the stored column address and stored partialrow address are replaced by redundant cells in the spare column, whilethose cells in the defective cell's column not in the identified groupare not replaced. Thus, the efficiency of repairs is increased by theRountree system because only some of the redundant cells in the sparecolumn are used to repair the defective cell, while other redundantcells remain in the spare column to repair other defective cells.

Unfortunately, the Rountree repair system can be problematic as well,because storing a full column address and a partial row address forevery defective memory cell in need of repair requires a great deal ofstorage space (e.g., fuses, etc.). Consequently, the ever-increasingsize of modern semiconductor memories, and the corresponding increase inthe number of defective memory cells typically found, makes the Rountreerepair system increasingly prohibitive to use because of the amount ofstorage space it requires.

Therefore, there is a need in the art for an improved device and methodfor repairing a semiconductor memory containing a failing memory cell.Such a device and method should replace the failing cell with aredundant memory cell without replacing the failing cell's entire row orcolumn with the redundant cell's entire row or column. The device shouldalso replace multiple failing cells in different rows or columns withredundant memory cells in a single redundant row or column in order tomake more efficient use of redundant rows and columns, and should do sowithout the excessive need for storage space characteristic of theRountree repair system.

SUMMARY OF THE INVENTION

A block repair device in accordance with the present invention is usedin a semiconductor memory, such as a Dynamic Random Access Memory(DRAM), having a primary array with a defective cell and a redundantarray with a redundant row. The block repair device includes a set ofnon-volatile elements, such as fuses, anti-fuses, or flash EEPROM cells,that store a block repair configuration that determines the dimensions(e.g., the number of rows and columns spanned) of the repair block usedto repair the defective cell. Routing circuitry, such as mux circuitry,in the block repair device is configured by the block repairconfiguration to output some received row and column address bits in aselected ratio. Comparison circuitry in the block repair device thencompares the row and column address bits output by the routing circuitrywith a stored portion of the address of the defective cell that definesthe repair block. When a match occurs, the comparison circuitryimplements a block repair by activating the redundant row and by causingdata to be written to or read from the activated redundant row insteadof the primary array.

The present invention thus provides an efficient device for implementingblock repairs in a semiconductor memory. The device requires relativelyfew fuses or other non-volatile elements to implement a repair, incontrast to the Rountree and other conventional methods described above.

In other embodiments of the invention, the block repair device describedabove is incorporated into a semiconductor memory, a semiconductorsubstrate, such as a wafer, a DRAM, and an electronic system.

In a block repair method according to the present invention, asemiconductor memory having a primary array with a defective cell and aredundant array with a redundant row is repaired using a block repair.The dimensions of a repair block within the primary array for repairingthe defective cell are first selected, and those row and column addressbits of the defective cell that define the selected dimensions of therepair block are then stored using, for example, non-volatile elementswithin the semiconductor memory. A block repair configuration thatcorresponds to the selected dimensions of the repair block is alsostored using, for example, non-volatile elements. Those received row andcolumn address bits necessary to determine whether a received addressfalls within the repair block are then routed in accordance with thestored block repair configuration for comparison with the stored row andcolumn address bits of the defective cell. When a match occurs, memoryoperations within the primary array are temporarily disabled, theredundant row is fired, and data is then written to or read from a cellwithin the redundant row selected in accordance with non-stored row andcolumn address bits of the defective cell.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a prior art diagram illustrating conventional row and columnredundancy in a semiconductor memory;

FIG. 2 is a diagram illustrating repair of a semiconductor memory inaccordance with the present invention;

FIG. 3 is a block diagram showing a semiconductor memory in accordancewith the present invention;

FIGS. 4A, 4B, and 4C are circuit schematics showing fuses, anti-fuses,and flash EEPROM cells capable of use as non-volatile elements in thesemiconductor memory of FIG. 3;

FIG. 5 is a circuit schematic showing select circuitry of thesemiconductor memory of FIG. 3 in more detail;

FIG. 6 is a circuit schematic showing mux circuitry of the semiconductormemory of FIG. 3 in more detail;

FIG. 7 is a circuit schematic showing compare circuitry of thesemiconductor memory of FIG. 3 in more detail;

FIG. 8 is a diagram illustrating a semiconductor wafer on which thesemiconductor memory of FIG. 3 is fabricated; and

FIG. 9 is a block diagram of an electronic system incorporating thesemiconductor memory of FIG. 3.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Some general characteristics of the present invention will be describedwith respect to FIG. 2. This description will be followed by a detaileddescription of various embodiments of the present invention inconnection with FIGS. 3-10.

As shown in FIG. 2, a semiconductor memory 70 is repaired in accordancewith the present invention by replacing memory blocks 72 and 74 withrespective redundant rows 76 and 78. The position and dimensions (i.e.,number of rows and columns spanned) of the blocks 72 and 74 areadjustable so an optimum number of defective memory cells 80 may berepaired using a minimum number of redundant rows. As a result, thepresent invention provides a highly efficient device and method forrepairing a semiconductor memory. Also, the present invention providessuch repair efficiency without the excessive need for fusescharacteristic of the Rountree repair system previously discussed.

As shown in FIG. 3, selection fuses 90 in a 64 KB semiconductor memory92 of the present invention may be programmed to output a block repairenable signal EN and fuse signals F(0:2) to select circuitry 94. Whenactive, the block repair enable signal EN enables a block repair withina primary array 96 of the memory 92 using a selected redundant rowwithin a redundant array 98 of the memory 92. When inactive, the blockrepair enable signal EN enables conventional row repair within theprimary array 96 using the selected redundant row. When block repair isenabled within the primary array 96, the status of the fuse signalsF(0:2) determines the dimensions of the repaired block. Together, thefuse signals F(0:2) and the block repair enable signal EN may sometimesbe referred to as a “block repair configuration.”

It should be understood that only one enable signal EN and only one setof fuse signals F(0:2) are shown in FIG. 3 for purposes of clarity. Infact, redundant rows (e.g., arrow₀, arrow₁, arrow₂, etc.) within theredundant array 98 typically each have their own enable signal (i.e.,EN₀, EN₁, EN₂, etc.) and their own set of fuse signals (i.e., F₀(0:2),F₁(0:2), F₂(0:2), etc.) so that block repair or conventional repair canbe selected for each redundant row using its enable signal, and so thedimensions of the repair block can be determined for each redundant rowusing its fuse signals if block repair is selected.

Although the present invention will be described with respect to a 64 KBmemory, it should be understood that the invention is applicable to anysize memory. It should also be understood that the invention isapplicable to a wide variety of semiconductor memories, including, forexample, Dynamic Random Access Memories (DRAMs) and Static RAMs (SRAMs).Further, it should be understood that any non-volatile element (e.g.,fuses, anti-fuses, or flash EEPROM cells) will work for purposes of theselection fuses 90, as will be explained in more detail below withrespect to FIGS. 4A, 4B, and 4C.

Upon receiving the enable signal EN and the fuse signals F(0:2), theselect circuitry 94 outputs selection signals S(0:7) as follows:

TABLE 1 EN F2 F1 F0 S7 S6 S5 S4 S3 S2 S1 S0 S(0:7) 0 0 0 0 0 0 0 0 0 0 00  0 1 0 0 0 0 0 0 0 0 0 0 1  1 1 0 0 1 0 0 0 0 0 0 1 1  3 1 0 1 0 0 0 00 0 1 1 1  7 1 0 1 1 0 0 0 0 1 1 1 1 15 1 1 0 0 0 0 0 1 1 1 1 1 31 1 1 01 0 0 1 1 1 1 1 1 63 1 1 1 0 0 1 1 1 1 1 1 1 127  1 1 1 1 1 1 1 1 1 1 11 255 

Of course, it should be understood that although only one set ofselection signals S(0:7) are discussed here, in fact each redundant rowwithin the redundant row 98 typically has an associated set of selectionsignals S(0:7).

In response to the selection signals S(0:7), and upon receiving rowaddress signals RA(0:7) during a memory operation, mux circuitry 100outputs compare signals CMP(0:7) as follows:

TABLE 2 S(0:7) CMP7 CMP6 CMP5 CMP4 CMP3 CMP2 CMP1 CMP0  0 RA7 RA6 RA5RA4 RA3 RA2 RA1 RA0  1 RA7 RA6 RA5 RA4 RA3 RA2 RA1 φ  3 RA7 RA6 RA5 RA4RA3 RA2 φ φ  7 RA7 RA6 RA5 RA4 RA3 φ φ φ 15 RA7 RA6 RA5 RA4 φ φ φ φ 31RA7 RA6 RA5 φ φ φ φ φ 63 RA7 RA6 φ φ φ φ φ φ 127  RA7 φ φ φ φ φ φ φ 255 φ φ φ φ φ φ φ φ

Of course, each redundant row within the redundant array 98 typicallyhas its own associated set of compare signals CMP(0:7).

The mux circuitry 100 thus passes the most significant bits of the rowaddress RA (0:7) through in accordance with the selection signalsS(0:7). As will be discussed below, this determines the “height” (i.e.,the number of rows spanned) of a repair block. Thus, for example, withthe selection signals S(0:7) all set to zero, the repair block has theheight of a single row (because all bits of the row address RA(0:7) arepassed through as compare signals CMP(0:7)). This only occurs when therepair block enable signal EN is inactive, so that conventional rowrepair is enabled. If, instead, the selection signals S(0:7) are set tofifteen, for example, then the repair block is sixteen rows high(because the four most significant bits of the row address RA(0:7) arepassed through the mux circuitry 100). Finally, if the selection signalsS(0:7) are set to two-hundred fifty-five for example, then the repairblock is two-hundred fifty-six rows high (i.e., the height of an entirecolumn).

A portion of the address of a defective memory cell within the primaryarray 96 is stored using bad address storage fuses 102 and is output bythe fuses 102 as bad address BA(0:7). If, for example, conventional rowrepair is being used to repair the defective memory cell, then the fuses102 are programmed to output a bad address BA(0:7) equivalent to the rowaddress of the defective cell. If, instead, a repair block sixteen rowshigh, for example, is being used to repair the defective cell, then thefuses 102 are programmed so the four most significant bits of the badaddress (i.e., BA7, BA6, BA5, and BA4) match the four most significantbits of the row address of the defective cell, and so the four leastsignificant bits of the bad address (i.e., BA3, BA2, BA1, and BA0) matchthe four most significant bits of the column address of the defectivecell (for reasons that will be explained below). Finally, if the repairblock used to repair the defective cell is an entire column within theprimary array 96, then none of the fuses 102 are programmed with bitsfrom the row address of the defective memory cell. Instead, the fuses102 are programmed with the column address of the defective memory cell(again, for reasons that will be explained below).

Of course, it should be understood that each redundant row in theredundant array 98 typically has its own associated bad address BA(0:7).Only one is discussed here for purposes of clarity. Also, it should beunderstood that the fuses 102 may comprise any non-volatile elementincluding, for example, fuses, anti-fuses, or flash EEPROM cells, aswill be discussed below with respect to FIGS. 4A, 4B, and 4C.

Upon receiving the compare signals CMP(0:7), compare circuitry 104compares any portion of the compare signals CMP(0:7) that includes bitsof the row address RA(0:7) with any corresponding portion of the badaddress BA(0:7) that contains bits of the row address of the defectivememory cell. If a match occurs, the compare circuitry 104 fires aredundant row within the redundant array 98.

More specifically, the compare circuitry 104 masks out any portion ofthe compare signals CMP(0:7) and the bad address BA(0:7) that does notinclude a row address bit using the selection signals S(0:7) as themask. The remaining portions of the compare signals CMP(0:7) and the badaddress BA(0:7) that do include row address bits are then compared, andthe selected redundant row is fired when a match occurs. This process issummarized by the following logic equation:

rrow=CMP(0:7)·S*(0:7)⊙BA(0:7)·S*(0:7)  (1)

where a “*” indicates a logical complement, a “·” indicates a logicalAND operation, and a “⊙” indicates a logical XAND operation (thecomplement of a logical XOR operation).

Thus, for example, if block repair is enabled and the repair block issixteen rows high, then the masking and comparing operations are asfollows in the case of a match:

10101101 CMP(0:7) 11110000 S*(0:7) 10100000 masked CMP(0:7) 10101101BA(0:7) 11110000 S*(0:7) 10100000 masked BA(0:7) 10100000 maskedCMP(0:7) 10100000 masked BA(0:7) 11111111 match, so fire rrow

At the same time a redundant row (e.g., arrow) within the redundantarray 98 is being fired as the result of a match within the comparecircuitry 104, the received row address RA(0:7) is causing a row decoder106 associated with the primary array 96 to fire a selected one of 256primary rows WL(0:255). Thus, both a redundant row and a primary row arefired while the semiconductor memory 92 awaits a column address CA(0:7)to determine whether data will be written to or read from the primaryarray 96 or the redundant array 98.

Upon receiving the column address CA(0:7), the mux circuitry 100 updatesthe compare signals CMP(0:7) to include the column address CA(0:7) asfollows:

TABLE 3 S(0:7) CMP7 CMP6 CMP5 CMP4 CMP3 CMP2 CMP1 CMP0  0 RA7 RA6 RA5RA4 RA3 RA2 RA1 RA0  1 RA7 RA6 RA5 RA4 RA3 RA2 RA1 CA7  3 RA7 RA6 RA5RA4 RA3 RA2 CA6 CA7  7 RA7 RA6 RA5 RA4 RA3 CA5 CA6 CA7 15 RA7 RA6 RA5RA4 CA4 CA5 CA6 CA7 31 RA7 RA6 RA5 CA3 CA4 CA5 CA6 CA7 63 RA7 RA6 CA2CA3 CA4 CA5 CA6 CA7 127  RA7 CA1 CA2 CA3 CA4 CA5 CA6 CA7 255  CA0 CA1CA2 CA3 CA4 CA5 CA6 CA7

Upon receiving the updated compare signals CMP(0:7), the comparecircuitry 104 compares the updated compare signals CMP(0:7) to the badaddress BA(0:7). When a match occurs, the circuitry 104 activates amatch signal 108 that deactivates a column decoder 110 associated withthe primary array 96 and directs data path circuitry 112 to input oroutput data D_(r) from the redundant array 98. When a match does notoccur, the column decoder 110 remains active and it selects data D_(p)from the primary array 96 in accordance with the column address CA(0:7)for inputting or outputting through the data path circuitry 112. Thisprocess is summarized by the following logic equation:

match=CMP(0:7)⊙BA(0:7)  (2)

When data D_(r) is written to or read from the redundant array 98, it isselected by a column decoder 114 in accordance with redundant decodesignals DEC(0:7) that are output by the mux circuitry 100 as follows:

TABLE 4 S(0:7) DEC7 DEC6 DEC5 DEC4 DEC3 DEC2 DEC1 DEC0  0 CA0 CA1 CA2CA3 CA4 CA5 CA6 CA7  1 CA0 CA1 CA2 CA3 CA4 CA5 CA6 RA0  3 CA0 CA1 CA2CA3 CA4 CA5 RA1 RA0  7 CA0 CA1 CA2 CA3 CA4 RA2 RA1 RA0 15 CA0 CA1 CA2CA3 RA3 RA2 RA1 RA0 31 CA0 CA1 CA2 RA4 RA3 RA2 RA1 RA0 63 CA0 CA1 RA5RA4 RA3 RA2 RA1 RA0 127  CA0 RA6 RA5 RA4 RA3 RA2 RA1 RA0 255  RA7 RA6RA5 RA4 RA3 RA2 RA1 RA0

Of course, it will be understood that each redundant row within theredundant array 98 has its own associated set of redundant decodesignals. Only one set is described here for purposes of clarity.

The selection fuses 90 and the bad address storage fuses 102 of FIG. 3may comprise any non-volatile elements including, for example, fuses 120as shown in FIG. 4A, anti-fuses 122 as shown in FIG. 4B, and flashEEPROM cells as shown in FIG. 4C.

As shown in FIG. 5, the select circuitry 94 of FIG. 3 includes a NORgate 130, inverters 132, and NAND gates 134 for implementing theoperations of the circuitry 94 as described above with respect toTable 1. Of course, it should be understood that any device forselecting the height and width of a repair block will work for purposesof the present invention, and that such a device need not necessarilyinclude the circuitry shown in FIG. 5 or operate in accordance withTable 1.

As shown in FIG. 6, the mux circuitry 100 includes a plurality of muxcircuits 140 for implementing the operations of the circuitry 100 asdescribed above with respect to Tables 2, 3, and 4. Again, it should beunderstood that any device for routing the proper row and columnaddresses to the compare circuitry 104 (see FIG. 3) will work forpurposes of the present invention, and that such a device need notnecessarily operate in accordance with Tables 2, 3, and 4.

As shown in FIG. 7, the compare circuitry 104 includes logic low inputAND gates 150, XAND gates 152 (each comprising, e.g., an XOR gate inseries with an inverter), and AND gates 154 for implementing theoperations of the circuitry 104 as described above with respect toequations (1) and (2). It should be understood that the gates 150, 152,and 154 are representative only, and that an actual implementation ofthe compare circuitry 104 would likely include multiple gates forperforming the operations of the circuitry 104. For example, the logiclow input AND gates 150 are shown in FIG. 7 as receiving fourteen inputseach and outputting seven outputs each. In reality, each of the gates150 is typically implemented using seven low input AND gates, with eachsuch gate receiving two inputs and outputting one output. Further, itshould be understood that any device for comparing the compare signalsCMP(0:7) to the bad address BA(0:7) will work for purposes of thepresent invention, and that such a device need not necessarily workusing the masking and comparing operations described above with respectto FIG. 3.

It should be noted that, as described thus far, the present inventiononly uses repair blocks that stay within “logical” boundaries of theprimary array 96 of FIG. 3. In addition, a repair block that spans onequarter of the rows in the top half of the primary array 96, forexample, and one quarter of the rows in the bottom half can beimplemented using an alternative embodiment described below.

In this alternative embodiment, repair blocks that cross logicalboundaries within the primary array 96 of FIG. 3 may be used. Forexample, a repair block that spans an odd number of rows in the top halfof the primary array 96 and an even number of rows in the bottom halfcan be implemented using this alternative embodiment. Such an embodimenttypically requires that additional bad address storage fuses 102 (seeFIG. 3) be provided to store additional bits from the row and columnaddresses of a defective memory cell. These additional bits aretypically necessary to identify a match when row and column addressesare received. Such an embodiment also typically requires that thecompare circuitry 104 (see FIG. 3) be constructed to perform thenecessary logical operations to determine a match. This embodiment thusrequires additional fuses or other non-volatile elements, but providesgreater flexibility in selecting the optimum location of repair blocks.

In the specific example described, the row address Most Significant Bit(MSB) may be replaced with an XOR function of the MSB and the next lowerrow address term for the repair address match. Likewise, logicalcombinations of column address terms may be used in place of singlecolumn address terms to “shift” or split the repair block in the columndimension. For example, replacing the column MSB with an XAND functionof the two most significant column address bits will split the repairblock and match upper and lower quarters of the column address spacerather than upper or lower halfs.

As shown in FIG. 8, the semiconductor memory 92 of FIG. 3 is fabricatedon a semiconductor wafer 160. It should be understood that the memory 92may also be fabricated on a wide variety of other semiconductorsubstrates including, for example, a Silicon-On-Insulator (SOI)substrate, a Silicon-On-Glass (SOG) substrate, and a Silicon-On-Sapphire(SOS) substrate.

As shown in FIG. 9, an electronic system 170 includes an input device172, an output device 174, a processor device 176, and a memory device178 that incorporates the semiconductor memory 92 of FIG. 3. Of course,it should be understood that the semiconductor memory 92 may also beincorporated into any one of the input, output, and processor devices172, 174, and 176.

Although the present invention has been described with reference toparticular embodiments, the invention is not limited to these describedembodiments. Rather, the invention is limited only by the appendedclaims, which include within their scope all equivalent devices ormethods that operate according to the principles of the invention asdescribed.

I claim:
 1. A semiconductor memory comprising: a primary array; a firstset of non-volatile elements for storing at least a portion of anaddress of a defective cell of the primary array; a redundant arrayhaving a redundant row; data path circuitry coupled to the primary andredundant arrays for writing data thereto and reading data therefrom; asecond set of non-volatile elements for storing a block repairconfiguration; routing circuitry coupled to the second set ofnon-volatile elements to be configured by the block repair configurationto output a selected ratio of received row address bits to receivedcolumn address bits; and comparison circuitry coupled to the first setof non-volatile elements, the redundant array, the data path circuitry,and the routing circuitry for comparing the row and column address bitsoutput by the routing circuitry with the stored portion of the defectivecell address and, when a match occurs, for implementing a block repairof the defective cell by activating the redundant row in the redundantarray and directing the data path circuitry to write data to or readdata from the activated redundant row instead of the primary array. 2.The semiconductor memory of claim 1 wherein the primary and redundantarrays are selected from a group comprising Dynamic Random Access Memory(DRAM) arrays and Static RAM (SRAM) arrays.
 3. The semiconductor memoryof claim 1 wherein the non-volatile elements are selected from a groupcomprising fuses, anti-fuses, and flash EEPROM cells.
 4. Thesemiconductor memory of claim 1 wherein the first set of non-volatileelements comprise non-volatile elements for storing at least a portionof the row address and at least a portion of the column address of thedefective cell.
 5. The semiconductor memory of claim 1 wherein therouting circuitry comprises select circuitry and mux circuitry.
 6. Thesemiconductor memory of claim 5 wherein the select circuitry comprisesinverters, NOR gates, and NAND gates, and wherein the mux circuitrycomprises muxes and inverters.
 7. The semiconductor memory of claim 1wherein the comparison circuitry comprises AND gates and XAND gates. 8.The semiconductor memory of claim 1 wherein the comparison circuitryincludes circuitry for masking column address bits output by the routingcircuitry and column address bits in the stored portion of the defectivecell address prior to comparing the address bits output by the routingcircuitry with the stored portion of the defective cell address.
 9. Thesemiconductor memory of claim 1 wherein the second set of non-volatileelements includes a block repair enabling non-volatile element forenabling block repairs when active and disabling block repairs, andthereby enabling conventional row repairs, when inactive.
 10. Thesemiconductor memory of claim 9 wherein the first set of non-volatileelements stores only row address bits of the defective cell.
 11. Thesemiconductor memory of claim 1 wherein the comparison circuitrycomprises circuitry for implementing a block repair that does not crosslogical boundaries within the primary array.
 12. A Dynamic Random AccessMemory (DRAM) comprising: a primary DRAM array; bad address storagefuses for storing at least a portion of an address of a defective cellof the primary DRAM array; a redundant DRAM array having a redundantrow; data path circuitry coupled to the primary and redundant DRAMarrays for writing data thereto and reading data therefrom; row andcolumn decoders coupled to the primary DRAM array for selecting cellstherein in accordance with received row and column addresses; selectionfuses for storing a block repair configuration; selection and muxcircuitry coupled to the selection fuses to be configured by the blockrepair configuration to output a selected ratio of received row addressbits to received column address bits; and comparison circuitry coupledto the bad address storage fuses, the redundant DRAM array, the datapath circuitry, the primary DRAM array column decoder, and the selectionand mux circuitry for comparing the row and column address bits outputby the selection and mux circuitry with the stored portion of thedefective cell address and, when a match occurs, for implementing ablock repair of the defective cell by activating the redundant row inthe redundant DRAM array, by disabling the primary DRAM array columndecoder, and by directing the data path circuitry to write data to orread data from the activated redundant row instead of the primary DRAMarray.
 13. A block repair device for a semiconductor memory having aprimary array and a redundant array with a redundant row, the blockrepair device comprising: a set of non-volatile elements for storing ablock repair configuration; routing circuitry coupled to thenon-volatile elements to be configured by the block repair configurationto output a selected ratio of received row address bits to receivedcolumn address bits; and comparison circuitry coupled to the routingcircuitry for comparing the row and column address bits output by therouting circuitry with a stored portion of an address of a defectivecell of the primary array and, when a match occurs, for implementing ablock repair of the defective cell by activating the redundant row andcausing data to be written to or read from the activated redundant rowinstead of the primary array.
 14. A semiconductor substrate on which isfabricated a semiconductor memory comprising: a primary array; a firstset of non-volatile elements for storing at least a portion of anaddress of a defective cell of the primary array; a redundant arrayhaving a redundant row; data path circuitry coupled to the primary andredundant arrays for writing data thereto and reading data therefrom; asecond set of non-volatile elements for storing a block repairconfiguration; routing circuitry coupled to the second set ofnon-volatile elements to be configured by the block repair configurationto output a selected ratio of received row address bits to receivedcolumn address bits; and comparison circuitry coupled to the first setof non-volatile elements, the redundant array, the data path circuitry,and the routing circuitry for comparing the row and column address bitsoutput by the routing circuitry with the stored portion of the defectivecell address and, when a match occurs, for implementing a block repairof the defective cell by activating the redundant row in the redundantarray and directing the data path circuitry to write data to or readdata from the activated redundant row instead of the primary array. 15.The semiconductor substrate of claim 14 wherein the substrate comprisesa semiconductor wafer.
 16. An electronic system comprising an inputdevice, an output device, a memory device, and a processor devicecoupled to the input, output, and memory devices, at least one of theinput, output, memory, and processor devices including a semiconductormemory comprising: a primary array; a first set of non-volatile elementsfor storing at least a portion of an address of a defective cell of theprimary array; a redundant array having a redundant row; data pathcircuitry coupled to the primary and redundant arrays for writing datathereto and reading data therefrom; a second set of non-volatileelements for storing a block repair configuration; routing circuitrycoupled to the second set of non-volatile elements to be configured bythe block repair configuration to output a selected ratio of receivedrow address bits to received column address bits; and comparisoncircuitry coupled to the first set of non-volatile elements, theredundant array, the data path circuitry, and the routing circuitry forcomparing the row and column address bits output by the routingcircuitry with the stored portion of the defective cell address and,when a match occurs, for implementing a block repair of the defectivecell by activating the redundant row in the redundant array anddirecting the data path circuitry to write data to or read data from theactivated redundant row instead of the primary array.
 17. A block repairmethod for a semiconductor memory having a primary array with adefective cell and a redundant array with a redundant row, the blockrepair method comprising: selecting the dimensions of a repair blockwithin the primary array for repairing the defective cell; programmingnon-volatile elements within the semiconductor memory to store those rowand column address bits of the defective cell that define the selecteddimensions of the repair block; programming other non-volatile elementswithin the semiconductor memory to store a block repair configurationthat corresponds to the selected dimensions of the repair block; inaccordance with the block repair configuration, routing those receivedrow and column address bits necessary to determine whether a receivedaddress falls within the repair block for comparison with the stored rowand column address bits of the defective cell; and when a match occurs,firing the redundant row and writing data to or reading data from a cellwithin the redundant row selected in accordance with those row andcolumn address bits of the defective cell not stored by the non-volatileelements.
 18. The block repair method of claim 17 wherein the steps ofprogramming non-volatile elements comprise programming non-volatileelements selected from a group comprising fuses, anti-fuses, and flashEEPROM cells.
 19. A block repair method for a semiconductor memoryhaving a primary array with a defective cell and a redundant array witha redundant row, the block repair method comprising: selecting thedimensions of a repair block within the primary array for repairing thedefective cell; storing those row and column address bits of thedefective cell that define the selected dimensions of the repair block;storing a block repair configuration that corresponds to the selecteddimensions of the repair block; in accordance with the block repairconfiguration, routing those received row and column address bitsnecessary to determine whether a received address falls within therepair block for comparison with the stored row and column address bitsof the defective cell; and when a match occurs, firing the redundant rowand writing data to or reading data from a cell within the redundant rowselected in accordance with any non stored row and column address bitsof the defective cell.
 20. The block repair method of claim 19 whereinboth steps of storing comprise storing using non-volatile elementsselected from a group comprising fuses, anti-fuses, and flash EEPROMcells.
 21. The block repair method of claim 19 wherein the step ofrouting received row and column address bits comprises muxing receivedrow and column address bits in accordance with the block repairconfiguration.
 22. The block repair method of claim 19, furthercomprising, when a match occurs, disabling memory operations within theprimary array by disabling a column decoder associated with the primaryarray.
 23. The block repair method of claim 19 wherein the step ofwriting data to or reading data from a cell within the redundant rowcomprises writing data to or reading data from the cell selected by acolumn decoder associated with the redundant array.
 24. The block repairmethod of claim 19 wherein the step of storing a block repairconfiguration includes programming a non-volatile element to enableblock repair with respect to the redundant row.
 25. The block repairmethod of claim 19 wherein the step of storing a block repairconfiguration includes programming a non-volatile element to disableblock repair with respect to the redundant row and thereby enableconventional row repair using the redundant row.
 26. The block repairmethod of claim 25 wherein the step of storing those row and columnaddress bits of the defective cell that define the selected dimensionsof the repair block comprises storing only row address bits of thedefective cell.